DocumentCode :
1561239
Title :
Minimizing reflections and cross-talk in chip packages
Author :
Ndip, Ivan ; John, Werner ; Reichl, Herbert
Author_Institution :
Fraunhofer Inst. for Reliability & Microintegration, Berlin
Volume :
1
fYear :
2005
Abstract :
One of the main objectives of optimizing the performance of chip packages is to create electrically transparent interconnections between the chips in electronic systems. This performance optimization can only be achieved if signal integrity (SI) problems such as reflections and cross-talk that occur within the packages can be reduced to within acceptable limits. In this contribution, we present novel techniques used for the derivation of design rules to minimize reflections and cross-talk in chip packages. Examples of such design rules include the following: Using an optimal choice and design of bends on package traces as well as vias to minimize reflections and distortions; Considering the effects of technological tolerances at the beginning of the design cycle to prevent unexpected reflections; Using an optimal choice of substrate technology, as well as an optimal number and arrangement of power/ground interplane vias in the vicinity of sensitive signal paths, so as to minimize cross-talk between package traces and vias, respectively
Keywords :
chip scale packaging; crosstalk; integrated circuit interconnections; chip packages; cross-talk minimization; electrical transparent interconnections; package traces; power-ground interplane vias; reflection minimization; sensitive signal paths; signal integrity; substrate technology; Distortion; Electromagnetic coupling; Electromagnetic reflection; Electronics packaging; Guidelines; Impedance; Optimization; Process design; Radio frequency; Signal design;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
Type :
conf
DOI :
10.1109/EPTC.2005.1614365
Filename :
1614365
Link To Document :
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