Title :
Very thin packaging of capped MEMS accelerometer device
Author :
Lacsamana, E.S. ; Navarro, R.M. ; Mena, M.G. ; Felton, L.E. ; Webster, W.A.
Author_Institution :
Micromachined Product Div., Analog Devices Inc., General Trias
Abstract :
Analog Devices Inc. (ADI) has been a major supplier of accelerometer devices in hermetic packages used for crash detection and vehicle dynamic control in the automotive industry. A major market pull from the handheld customers makes it imperative to develop thin plastic packaging solution for MEMS accelerometer. This paper details the backgrinding process developed to successfully thin the wafer-level-capped MEMS accelerometer. Functionality is maintained after packaging the thinned device, a significant effect in performance is observed. Three packaging solutions are evaluated to produce a 4times4times1 mm3 leadframe chip scale package (LFCSP). The performance of the thinned accelerometer device using the thin packaging options is compared. Assembly issues of the thin packages are also discussed
Keywords :
accelerometers; assembling; chip scale packaging; micromechanical devices; backgrinding process; leadframe chip scale package; thin package assembling; thin plastic packaging; wafer level capped MEMS accelerometers; Accelerometers; Assembly; Automotive engineering; Chip scale packaging; Industrial control; Micromechanical devices; Plastic packaging; Vehicle crash testing; Vehicle detection; Vehicle dynamics;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614374
