• DocumentCode
    1561310
  • Title

    SOI pressure sensor

  • Author

    French, P.J. ; Muro, H. ; Shinohara, T. ; Nojiri, H. ; Kaneko, H.

  • Author_Institution
    Nissan Motor Co. Ltd., Yokosuka, Japan
  • fYear
    1991
  • Firstpage
    181
  • Lastpage
    184
  • Abstract
    The authors present a technique for fabricating single crystal silicon-on-oxide pressure sensors for high temperature applications. The SOI structure is formed from substrate material by etching techniques and thus good quality single crystal can be achieved without requiring lengthy or expensive processing. Islands of single crystal surrounded by oxide were fabricated. The islands are 7 mu m wide with a depth of 4.5 mu m. There are no pn junction isolations and the device can thus operate at higher temperatures. Longitudinal gauge factors of approximately 90 with a TCGF (temperature coefficient of gauge factor) of -0.22%/K were achieved for the lower doped samples. No leakage between resistors and the substrate could be detected for temperatures up to 300 degrees C.<>
  • Keywords
    electric sensing devices; etching; high-temperature techniques; pressure transducers; semiconductor devices; semiconductor technology; semiconductor-insulator boundaries; 300 degC; 4.5 micron; 7 micron; SOI pressure sensor; Si; Si-SiO/sub 2/; etching; high temperature; longitudinal gauge factors; single crystal; temperature coefficient of gauge factor; Capacitive sensors; Crystallization; Etching; Oxidation; Piezoresistance; Resistors; Silicon; Substrates; Temperature sensors; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors and Actuators, 1991. Digest of Technical Papers, TRANSDUCERS '91., 1991 International Conference on
  • Conference_Location
    San Francisco, CA, USA
  • Print_ISBN
    0-87942-585-7
  • Type

    conf

  • DOI
    10.1109/SENSOR.1991.148832
  • Filename
    148832