Failure study of Sn-Ag-Cu lead-free solder joint by digital image speckle analysis (DISA)

Author

Xu, Luhua ; Pang, John H L ; Che, FaXing

Author_Institution

Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore

Volume

1

fYear

2005

Abstract

Failure analysis of lead-free solder joints for PBGA assemblies subjected to thermal cycling aging is reported. A micro-digital image speckle correlation system (Micro-DISC) was employed for micro-deformation and strain analysis. The Sn-3.8Ag-0.7Cu (SAC) soldered assembly was subject to a temperature ramp from room temperature of 25 degC to 125 degC. The growth of interfacial IMC compounds and the interfacial voids/crack formation between SAC ENIG surface finish were observed on all the solder joints and correlated with effect of stress. It is noted that IMC layer thickness at different locations are different after 3000 thermal cycling aging. The highest IMC layer thickness was observed at the outermost solder joint. The formation of void/crack and the failure site agrees with the strain field measured by DISA technique

Keywords

ageing; assembling; ball grid arrays; copper alloys; cracks; failure analysis; silver alloys; solders; speckle; stress effects; surface finishing; tin alloys; voids (solid); 25 to 125 C; DISA; PBGA assemblies; SnAgCu; crack formation; digital image speckle analysis; failure analysis; interfacial IMC compounds; lead-free solder joint; micro-DISC; micro-deformation analysis; micro-digital image speckle correlation system; strain analysis; surface finish; thermal cycling aging; void formation; Aging; Assembly; Digital images; Environmentally friendly manufacturing techniques; Failure analysis; Image analysis; Lead; Soldering; Speckle; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th

Conference_Location

Singapore

Print_ISBN

0-7803-9578-6

Type

conf

DOI

10.1109/EPTC.2005.1614379

Filename

1614379