DocumentCode :
1561400
Title :
The analysis of capacitive pressure sensors with large deflection
Author :
Tong, Lijun ; Hsu, Jen-Tai ; Ko, Wen H. ; Ding, Xiaoyi
Author_Institution :
Dept. of Electr. Eng. & Appl. Phys., Case Western Reserve Univ., Cleveland, OH, USA
fYear :
1991
Firstpage :
185
Lastpage :
187
Abstract :
A set of analytical equations for the calculation of large deflection of square or rectangular boron-doped P/sup +/-Si diaphragms under pressure is obtained. Based on these equations and the mechanical properties of the Si thin diaphragm, such as the residual stresses, direct and shearing stresses, and Young´s modulus, a computer program using a personal computer was developed to calculate the deformation of the boron-doped P/sup +/-Si thin diaphragm, and the capacitance and sensitivity of a silicon capacitive sensor. A calculated curve for capacitive sensors with a thin silicon diaphragm agrees well with the measured results of those sensors. This simulation can be a simple but useful tool for the design of a large-deformation silicon capacitive pressure sensor.<>
Keywords :
CAD; Young´s modulus; boron; deformation; diaphragms; digital simulation; electric sensing devices; elemental semiconductors; internal stresses; pressure transducers; shear strength; silicon; Si:B sensor; Young´s modulus; analytical equations; capacitive pressure sensors; computer program; deflection; deformation; digital simulation; p/sup +/-Si sensor; personal computer; residual stresses; sensitivity; shearing stresses; Capacitance; Capacitive sensors; Computational modeling; Equations; Mechanical factors; Mechanical sensors; Microcomputers; Residual stresses; Shearing; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors and Actuators, 1991. Digest of Technical Papers, TRANSDUCERS '91., 1991 International Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-87942-585-7
Type :
conf
DOI :
10.1109/SENSOR.1991.148833
Filename :
148833
Link To Document :
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