Title :
High frequency characterization of 100 micron pitch wafer level package interconnects
Author :
Jayabalan, Jayasanker ; Rotaru, Mihai D.
Abstract :
In this paper, the characterization of wafer level packages with different types of 100 micron pitch off-chip interconnects in an elastomer probe based test bench is described. The simulated and measured time domain data demonstrate 5 gigabit per second performance with the interconnects. Insertion loss of about 3 dB and return loss of 10 dB are obtained at 5 GHz from frequency domain measurements
Keywords :
elastomers; fine-pitch technology; frequency-domain analysis; integrated circuit interconnections; integrated circuit packaging; time-domain analysis; 10 dB; 100 micron; 5 GHz; 5 Gbit/s; elastomer probe; frequency domain measurement; high frequency characterization; insertion loss; off-chip interconnects; time domain data; wafer level package interconnects; Costs; Frequency domain analysis; Frequency measurement; Packaging; Probes; Semiconductor device modeling; Sockets; Testing; Time measurement; Wafer scale integration;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614389
