Title :
Wafer level thin film encapsulation for MEMS
Author :
Gillot, C. ; Pornin, J.L. ; Arnaud, A. ; Lagoutte, E. ; Sillon, N. ; Souriau, J.C.
Author_Institution :
CEA-LETI, Grenoble
Abstract :
Because they have moving parts, or because they need to work in a specific atmosphere (vacuum, inert gas,...), microelectromechanical systems (MEMS) are not compatible with standard integrated circuit (IC) packaging technologies. Specific packaging needs represent a great part of the final manufacturing cost of such devices. This article presents a solution to encapsulate RF MEMS devices in hermetically sealed cavities, using only standard IC manufacturing technologies at wafer level. This thin film pre-packaging process enables MEMS protection and greatly reduces the cost of final packaging. Compatibility of thin film packaging with standard IC packaging technology is studied
Keywords :
encapsulation; hermetic seals; micromechanical devices; thin films; IC manufacturing technology; IC packaging technology; MEMS protection; RF MEMS devices; hermetically sealed cavities; microelectromechanical systems; thin film packaging; wafer level thin film encapsulation; Atmosphere; Costs; Encapsulation; Integrated circuit packaging; Integrated circuit technology; Manufacturing; Micromechanical devices; Thin film circuits; Transistors; Wafer scale integration;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614401
