Title :
Correlation between package-level ball impact test and board-level drop test
Author :
Yeh, Chang-Lin ; Lai, Yi-Shao ; Chang, Hsiao-Chuan ; Chen, Tsan-Hsien
Author_Institution :
Stress Reliability Lab., Adv. Semicond. Eng., Inc., Kaohsiung
Abstract :
Package-level ball impact test and board-level drop test are performed and correlated empirically using a specific chip-scale package with solder joints of different Sn-Ag-Cu solder compositions. A positive correlation is found between characteristics of the impact force profile and reliability from the drop test, which provides a supporting basis for the package-level ball impact test to serve as a substitute of the timely and costly board-level drop test
Keywords :
chip scale packaging; copper alloys; impact testing; production testing; reliability; silver alloys; solders; tin alloys; SnAgCu; board level drop test; chip-scale package; package level ball impact test; solder joints; Chip scale packaging; Electronics packaging; Environmentally friendly manufacturing techniques; Lead; Semiconductor device packaging; Semiconductor device testing; Soldering; System testing; Vehicle dynamics; Vehicles;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614405
