Title :
Bondability and reliability for insulated wirebonding process with 63/spl mu/m pitch capability
Author :
Ibrahim, Mohd Rusli ; Bee, Albert Tiu Kong
Author_Institution :
Freescale Semicond. Malaysia Sdn. Bhd., Selangor
Abstract :
In an insulated gold wire bonding process, the understanding of stitch formation and bond reliability are the most challenging areas. In most cases, the eventual stitch pull is low and experiences frequent machine stoppages. This paper presents an innovative approach in wire bonding through special capillary movement to enable mechanical abrasion. The process also involves special capillary surface design to enable effective tearing of the wire insulation material at second bond. Series of evaluation were conducted to establish optimal wire coating thickness with good package reliability on different fine pitch devices
Keywords :
fine-pitch technology; gold; lead bonding; reliability; 63 micron; Au; bond reliability; capillary surface design; fine pitch devices; insulated wirebonding process; mechanical abrasion; optimal wire coating thickness; package reliability; stitch formation; wire insulation material; Assembly; Bonding processes; Cable insulation; Coatings; Gold; Packaging; Scanning electron microscopy; Temperature; Wafer bonding; Wire;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614407
