• DocumentCode
    1561638
  • Title

    LTCC based integration for RF applications

  • Author

    Wai, Lai L. ; Lu, Albert Chee W ; Fan, Wei ; Chua, Kai M. ; Sunappan, V.

  • Author_Institution
    Singapore Inst. of Manuf. Technol.
  • Volume
    1
  • fYear
    2005
  • Abstract
    Low temperature cofired ceramic technology (LTCC) is a substrate platform that provides true 3D integration whilst satisfying very high frequency performance requirements with good thermal characteristics. This paper describes the modeling and characterization of multilayer capacitor integration for rf applications
  • Keywords
    ceramic capacitors; 3D integration; LTCC substrate platform; low temperature cofired ceramic technology; multilayer capacitor integration; thermal characteristics; Capacitors; Ceramics; Current distribution; Electrodes; Fabrication; Inductance; Permittivity; Radio frequency; Surface impedance; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
  • Conference_Location
    Singapore
  • Print_ISBN
    0-7803-9578-6
  • Type

    conf

  • DOI
    10.1109/EPTC.2005.1614412
  • Filename
    1614412
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1561638