Title :
LTCC based integration for RF applications
Author :
Wai, Lai L. ; Lu, Albert Chee W ; Fan, Wei ; Chua, Kai M. ; Sunappan, V.
Author_Institution :
Singapore Inst. of Manuf. Technol.
Abstract :
Low temperature cofired ceramic technology (LTCC) is a substrate platform that provides true 3D integration whilst satisfying very high frequency performance requirements with good thermal characteristics. This paper describes the modeling and characterization of multilayer capacitor integration for rf applications
Keywords :
ceramic capacitors; 3D integration; LTCC substrate platform; low temperature cofired ceramic technology; multilayer capacitor integration; thermal characteristics; Capacitors; Ceramics; Current distribution; Electrodes; Fabrication; Inductance; Permittivity; Radio frequency; Surface impedance; Temperature;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614412
