Title :
4-dimensional design analysis and optimization of system-in-package
Author :
Tee, Tong Yan ; Ng, Hun Shen ; Luan, Jing-En ; Zhang, Xueren ; Goh, Kim Yong ; Grech, Anne Marie ; Duca, Roseanne
Author_Institution :
STMicroelectronics, Singapore
Abstract :
This paper is an overview of applications of CAE (computer-aided-engineering) in design for package and board level reliability of system-in-package (SiP). CAE is an efficient tool for virtual prototyping of complex SiP to save the development time and cost with understanding on the physics of failures. The paper highlights on five major reliability issues frequently encountered in the development of SiP, such as thermomechanical related package failures, matrix package warpage, moisture-induced package failures, board level solder joint reliability under thermal cycling test and drop test. For each individual topic, introduction, brief theory, and an example of application with correlation to experiment are given
Keywords :
computer aided engineering; failure analysis; rapid prototyping (industrial); reliability; system-in-package; virtual prototyping; 4D design analysis; computer-aided-engineering; design optimization; drop test; package failures; package warpage; solder joint reliability; system-in-package; thermal cycling test; thermomechanical failure; virtual prototyping; Application software; Computer aided engineering; Computer applications; Costs; Design optimization; Packaging; Physics; Testing; Thermomechanical processes; Virtual prototyping;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614415
