Title :
Optimal design in enhancing board-level thermomechanical and drop reliability of package-on-package stacking assembly
Author :
Lai, Yi-Shao ; Wang, Tong Hong ; Wang, Ching-Chun ; Yeh, Chang-Lin
Author_Institution :
Stress-Reliability Lab., Adv. Semicond. Eng. Inc., Kaohsiung
Abstract :
In this paper, the Taguchi optimization method is applied to obtain an optimal and robust design towards enhancement of board-level thermomechanical and drop reliability of a package-on-package stacking assembly under an accelerated thermal cycling test condition as well as a JEDEC drop test condition. An L18 (21 times 3 7) orthogonal array is arranged for the optimization of eight control factors for thermomechanical reliability while an L9 (34) orthogonal array of four control factors for drop reliability. Importance of each of these control factors is compared and ranked
Keywords :
Taguchi methods; design of experiments; life testing; optimisation; reliability; system-in-package; JEDEC drop test; Taguchi optimization; accelerated testing; drop reliability; optimal design; package-on-package stacking assembly; thermal cycling test; thermomechanical reliability; Assembly; Electronics packaging; Life estimation; Robustness; Semiconductor device packaging; Soldering; Stacking; Testing; Thermomechanical processes; Transient analysis;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614417
