Title :
Nanoindentation on SnAgCu lead-free solder and analysis
Author :
Xu, Luhua ; Pang, John H L
Author_Institution :
Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore
Abstract :
To improve the measurement accuracy of hardness and modulus results of lead-free SnAgCu from nanoindentation experiments, evaluation of the creep effect on measured result and was reported. For SnAgCu solder in this study, it was found that penetration continues with a very long time and the penetration depth could increase extra 1000 nm when the load was held constant. Thus the hardness becomes both time and load dependant. It also influences the value of modulus by affecting the upper part of the unloading curve. With optimized test method and CSM technique, Modulus of SAC387 solder alloy and all the layers in a solder joint was measured and reported. Two groups of modulus values for SAC387 were observed which were for the beta-tin phase and the eutectic phase, respectively
Keywords :
Young´s modulus; copper alloys; hardness testing; indentation; silver alloys; solders; tin alloys; CSM technique; SAC387 solder alloy; SnAgCu; creep effect; lead-free solder; nanoindentation; solder joints; test optimization; Aerospace engineering; Assembly; Creep; Environmentally friendly manufacturing techniques; Lead; Mechanical factors; Mechanical variables measurement; Optimization methods; Soldering; Testing;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614421
