Impact of drop-in lead free solders on microelectronics packaging

Author

Chew, Kai Hwa ; Pang, John H L

Author_Institution

Singapore Asahi Chem. & Solder Ind. Pte Ltd

Volume

2

fYear

2005

Abstract

Lead-free solders and soldering technology will be a revisited concern in microelectronics packaging challenges to meet the demands of wafers-level packaging and 3D packaging operations where greater demands will be made on soldering smaller pads sizes and the high expectations of solder joint strength and long-term reliability. This paper reports on the drop-in lead-free solder approach and will provide characterization research results on Sn-Ag-Cu-In drop-in solder material composition, wetting and assembly characteristics and mechanics properties for stress-strain and creep performance compared to Sn3.8Ag0.7Cu solder

Keywords

copper alloys; impact (mechanical); indium alloys; integrated circuit packaging; integrated circuit reliability; silver alloys; solders; tin alloys; Sn-Ag-Cu-In; assembly characteristics; creep performance; drop-in lead free solders; lead-free solders; long-term reliability; microelectronics packaging; solder joint strength; soldering technology; stress-strain performance; wafer-level packaging; wetting characteristics; Creep; Environmentally friendly manufacturing techniques; Fatigue; Lead; Microelectronics; Packaging; Soldering; Surface-mount technology; Temperature; Tin alloys;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th

Conference_Location

Singapore

Print_ISBN

0-7803-9578-6

Type

conf

DOI

10.1109/EPTC.2005.1614446

Filename

1614446