Title :
Fabrication process for high-density wiring interposer using photosensitive multiblock copolyimide insulation layers for 3D packaging
Author :
Kikuchi, Katsuya ; Oosato, Hirotaka ; Ito, Sachiko ; Segawa, Shigemasa ; Nakagawa, Hiroshi ; Tokoro, Kazuhiko ; Aoyagi, Masahiro
Author_Institution :
Nat. Inst. of Adv. Ind. Sci. & Technol., Ibaraki
Abstract :
We have developed a high-density wiring interposer for 10 Gbps signal propagation using a photosensitive polyimide. We optimized the basic properties of the photosensitive polyimide film and the lift-off process for the metal layer using an image-reversal-patterned negative photoresist for the fabrication of the interposer. We experimentally confirmed that the high-density wiring interposer could be fabricated using the polyimide and gold multilayered structure. Fine metal wiring was smoothly covered by the polyimide, as confirmed by scanning electron microscopy (SEM) of the cross section of the fabricated balance pair strip line structure
Keywords :
insulating materials; integrated circuit packaging; photoresists; polymer films; wiring; 10 Gbit/s; 3D packaging; copolyimide insulation layers; gold multilayered structure; high-density wiring interposer; lift-off process; metal layer; multiblock insulation layers; negative photoresist; photosensitive insulation layers; photosensitive polyimide film; polyimide multilayered structure; scanning electron microscopy; signal propagation; strip line structure; Dielectric constant; Dielectrics and electrical insulation; Fabrication; Large scale integration; Packaging; Polyimides; Research and development; Resists; Thickness control; Wiring;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614448
