Title :
Effect of solder voids on thermal performance of a high power electronic module
Author :
Biswal, Laxmidhar ; Krishna, Arvind ; Sprunger, Doug
Author_Institution :
Delphi Corp., Bangalore
Abstract :
A high-power automotive electronic module is evaluated thermally for assessing the impact of solder voids on the temperature of the silicon die during transient operations. Voids are present in the solder between the silicon die and the copper heat spreader due to out-gassing during solder reflow process. The solder voids are modeled explicitly to resolve spatial temperature gradients. The computational model without solder voids is first compared with the experimental data and then extended to account for solder voids. It is shown that there can be profound impact of solder voids on the temperature of the silicon die depending on the size and void fraction of the solder voids, but the effect of void distribution is not very significant. Hence, it is imperative to ensure that the package is free from the solder voids for high power transient applications
Keywords :
automotive electronics; copper; modules; reflow soldering; silicon; solders; voids (solid); Cu; Si; copper heat spreader; high power electronic module; high-power automotive electronic module; silicon die; solder reflow process; solder void effects; spatial temperature gradients; thermal performance; Automotive electronics; Computational modeling; Copper; Packaging; Power electronics; Semiconductor device modeling; Silicon; Spatial resolution; Temperature dependence; Temperature distribution;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614460
