Title :
Non-linear finite element analysis for electronic packages subjected to combined hygroscopic and thermo-mechanical stresses
Author :
Yoon, Samson ; Han, Bongtae ; Cho, Seungmin ; Jang, Chang-Soo
Author_Institution :
Dept. of Mech. Eng., Maryland Univ., College Park, MD
Abstract :
A finite element modeling scheme to analyze the combined effect of thermal and hygroscopic deformation is presented. The scheme employs the conventional moisture diffusion and heat transfer analysis capabilities available in the commercial FEM packages, but a new formulation is introduced to allow the time-dependent non-linear analysis of package deformations induced by hygroscopic as well as thermal expansion mismatches. Validity of modeling scheme is verified using time-dependent displacement fields of a bi-material specimen documented by real-time moire interferometry
Keywords :
deformation; diffusion; finite element analysis; heat transfer; mechanical testing; moisture; stress analysis; thermal expansion; thermal management (packaging); thermal stresses; FEM packages; bi-material specimen; electronic packages; finite element model; heat transfer analysis; hygroscopic deformation; hygroscopic stresses; moisture diffusion; nonlinear finite element analysis; real-time moire interferometry; thermal deformation; thermal expansion mismatches; thermo-mechanical stresses; time-dependent displacement fields; time-dependent nonlinear analysis; Capacitive sensors; Electronic packaging thermal management; Finite element methods; Heat transfer; Moisture; Polymers; Temperature; Thermal expansion; Thermal stresses; Thermomechanical processes;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614467
