DocumentCode :
1562149
Title :
Progress in the development of microcrystalline 3C-SiC, SiGeC and GeC thin films for solar cell applications
Author :
Konagai, Makoto ; Miyajima, Shinsuke ; Yashiki, Yasutoshi ; Watahiki, Tatsuro ; Narayanan, Kannan L. ; Yamada, Akira
Author_Institution :
Dept. of Phys. Electron., Tokyo Inst. of Technol., Japan
fYear :
2005
Firstpage :
1424
Lastpage :
1427
Abstract :
The research and development of microcrystalline 3C-SiC, SiGeC and GeC thin films for solar cell applications are presented. Hot wire CVD technique is employed to optimize the deposition parameters for achieving high quality μc-3C-SiC thin films whose bandgap is 2.2 eV. Monomethylsilane and hydrogen are used as reactant gases for the deposition of μc-SiC thin films. P and Al are used as dopants to successfully obtain n and p type μc-3C-SiC thin films. Doped μc-3C-SiC is very attractive for the potential window layer applications in Si thin film and Si heterojunction solar cells. Attempts to control the bandgap of μc-3C-SiC are done by incorporating Ge into SiC. Of late, we have succeeded to prepare μc-3C-SiGeC with a Ge content of 5%, which showed about 0.2 eV lower absorption spectra compared to that of 3C-SiC.
Keywords :
absorption coefficients; aluminium; chemical vapour deposition; crystal microstructure; electrical conductivity; energy gap; germanium compounds; phosphorus; semiconductor doping; semiconductor epitaxial layers; semiconductor growth; silicon compounds; solar cells; wide band gap semiconductors; GeC; SiC:Al; SiC:P; SiGeC; absorption spectra; bandgap; heterojunction solar cells; hot wire CVD technique; hydrogen; microcrystalline thin films; monomethylsilane; reactant gases; Gases; Heterojunctions; Hydrogen; Photonic band gap; Photovoltaic cells; Research and development; Semiconductor thin films; Sputtering; Transistors; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference, 2005. Conference Record of the Thirty-first IEEE
ISSN :
0160-8371
Print_ISBN :
0-7803-8707-4
Type :
conf
DOI :
10.1109/PVSC.2005.1488408
Filename :
1488408
Link To Document :
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