DocumentCode
1562180
Title
Coarsening processes in the lead-free solder alloy AgCu: theoretical and experimental investigations
Author
Müller, Wolfgang H. ; Böhme, Thomas
Author_Institution
Inst. fur Mechanik, Technische Univ. Berlin
Volume
2
fYear
2005
Abstract
Experimental investigations show that the microstructure of solders changes over time. In order to estimate the reliability and the lifetime of microelectronic solder materials it is important to predict the rate of microstructural change. Starting with an experimentally based overview on nucleation, spinodal decomposition as well as subsequent phase growth as observed in (lead-free) microelectronic solder connections this paper concentrates on the mathematical description of these phenomena
Keywords
copper alloys; nucleation; silver alloys; solders; spinodal decomposition; AgCu; coarsening process; lead-free microelectronic solder connections; lead-free solder alloy; microelectronic solder materials; microstructural change; nucleation; spinodal decomposition; Chemical elements; Copper; Electronics packaging; Environmentally friendly manufacturing techniques; Equations; Heat treatment; Intermetallic; Lead; Microelectronics; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location
Singapore
Print_ISBN
0-7803-9578-6
Type
conf
DOI
10.1109/EPTC.2005.1614475
Filename
1614475
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