• DocumentCode
    1562263
  • Title

    Experimental study of a radial micro-channel cooling plate

  • Author

    Poppe, A. ; Horváth, Gy ; Bognár, Gy ; Kohari, Z. ; Desmulliez, M.P.Y. ; Rencz, M.

  • Author_Institution
    Dept. of Electron Devices, Budapest Univ. of Technol. & Econ.
  • Volume
    2
  • fYear
    2005
  • Abstract
    The thermal behavior of a micro-channel cooling device has been investigated by using two different, complementary measurement methods. The measured sample was a square nickel plate micro-cooler holding 128 micro-channels in radial arrangement. In our previous studies we used only thermal transient measurements and the structure functions method to identify the partial thermal resistance corresponding to the cooler. In the current study the measurement setup was completed by a heat-flux sensor array placed under the micro-cooler. This way we could compare the heat-transfer coefficient values obtained: (1) from the identified thermal resistance value; and (2) calculated directly from the measured heat-flux values. Good matching of the values obtained the different methods was found
  • Keywords
    cooling; microchannel flow; microchannel plates; thermal management (packaging); thermal resistance; heat-flux sensor array; heat-transfer coefficient; microchannel cooling device; microchannel cooling plate; nickel plate microcooler; thermal behavior; thermal resistance; Cooling; Electrical resistance measurement; Electronic packaging thermal management; Electronics packaging; Microchannel; Nickel; Resistance heating; Sensor arrays; Thermal management; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
  • Conference_Location
    Singapore
  • Print_ISBN
    0-7803-9578-6
  • Type

    conf

  • DOI
    10.1109/EPTC.2005.1614484
  • Filename
    1614484