DocumentCode
1562263
Title
Experimental study of a radial micro-channel cooling plate
Author
Poppe, A. ; Horváth, Gy ; Bognár, Gy ; Kohari, Z. ; Desmulliez, M.P.Y. ; Rencz, M.
Author_Institution
Dept. of Electron Devices, Budapest Univ. of Technol. & Econ.
Volume
2
fYear
2005
Abstract
The thermal behavior of a micro-channel cooling device has been investigated by using two different, complementary measurement methods. The measured sample was a square nickel plate micro-cooler holding 128 micro-channels in radial arrangement. In our previous studies we used only thermal transient measurements and the structure functions method to identify the partial thermal resistance corresponding to the cooler. In the current study the measurement setup was completed by a heat-flux sensor array placed under the micro-cooler. This way we could compare the heat-transfer coefficient values obtained: (1) from the identified thermal resistance value; and (2) calculated directly from the measured heat-flux values. Good matching of the values obtained the different methods was found
Keywords
cooling; microchannel flow; microchannel plates; thermal management (packaging); thermal resistance; heat-flux sensor array; heat-transfer coefficient; microchannel cooling device; microchannel cooling plate; nickel plate microcooler; thermal behavior; thermal resistance; Cooling; Electrical resistance measurement; Electronic packaging thermal management; Electronics packaging; Microchannel; Nickel; Resistance heating; Sensor arrays; Thermal management; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location
Singapore
Print_ISBN
0-7803-9578-6
Type
conf
DOI
10.1109/EPTC.2005.1614484
Filename
1614484
Link To Document