• DocumentCode
    1562293
  • Title

    Spherical boron nitride fillers for high performance thermal greases

  • Author

    Gowda, Arun ; Paisner, Sara N. ; Tonapi, Sandeep ; Meneghetti, Paulo ; Hans, Paul ; Strosaker, Gregory ; Acharya, Ashwini ; Nagarkar, Kaustubh ; Srihari, K.

  • Author_Institution
    GE Global Res. Center, Niskayuna, NY
  • Volume
    2
  • fYear
    2005
  • Abstract
    Highly efficient thermal interface materials (TIMs) have become necessary to effectively manage the increasing heat generated at the silicon level with every new generation of microprocessors. Typically, TIMs consist of polymers that are highly loaded with thermally conductive fillers. Boron nitride (BN) fillers have been employed as a thermal conductive filler for TIMs for decades. However, conventional boron nitride fillers were largely anisotropic in nature. A novel spherical BN filler is presented as an isotropic thermally conductive filler for TIMs and the thermal and reliability performance characteristics of spherical BN filled high thermal performance greases are described
  • Keywords
    boron compounds; elemental semiconductors; filler metals; greases; silicon; thermal conductivity; thermal management (packaging); BN; Si; high performance thermal greases; microprocessors; reliability performance; spherical BN filler; spherical boron nitride fillers; thermal conductive filler; thermal interface materials; thermal performance; Aluminum; Boron; Ceramics; Conducting materials; Industrial electronics; Instruments; Polymers; Silver; Thermal conductivity; Zinc oxide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
  • Conference_Location
    Singapore
  • Print_ISBN
    0-7803-9578-6
  • Type

    conf

  • DOI
    10.1109/EPTC.2005.1614487
  • Filename
    1614487