DocumentCode :
1562293
Title :
Spherical boron nitride fillers for high performance thermal greases
Author :
Gowda, Arun ; Paisner, Sara N. ; Tonapi, Sandeep ; Meneghetti, Paulo ; Hans, Paul ; Strosaker, Gregory ; Acharya, Ashwini ; Nagarkar, Kaustubh ; Srihari, K.
Author_Institution :
GE Global Res. Center, Niskayuna, NY
Volume :
2
fYear :
2005
Abstract :
Highly efficient thermal interface materials (TIMs) have become necessary to effectively manage the increasing heat generated at the silicon level with every new generation of microprocessors. Typically, TIMs consist of polymers that are highly loaded with thermally conductive fillers. Boron nitride (BN) fillers have been employed as a thermal conductive filler for TIMs for decades. However, conventional boron nitride fillers were largely anisotropic in nature. A novel spherical BN filler is presented as an isotropic thermally conductive filler for TIMs and the thermal and reliability performance characteristics of spherical BN filled high thermal performance greases are described
Keywords :
boron compounds; elemental semiconductors; filler metals; greases; silicon; thermal conductivity; thermal management (packaging); BN; Si; high performance thermal greases; microprocessors; reliability performance; spherical BN filler; spherical boron nitride fillers; thermal conductive filler; thermal interface materials; thermal performance; Aluminum; Boron; Ceramics; Conducting materials; Industrial electronics; Instruments; Polymers; Silver; Thermal conductivity; Zinc oxide;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
Type :
conf
DOI :
10.1109/EPTC.2005.1614487
Filename :
1614487
Link To Document :
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