DocumentCode
1562337
Title
The Combination of Thermal and Electrical Improvements in a 1U 100A VRM
Author
Ball, Arthur ; Sterk, Douglas ; Lee, Fred C.
Author_Institution
Virginia Polytech. Inst. & State Univ., Blacksburg
fYear
2007
Firstpage
15
Lastpage
20
Abstract
The voltage regulator module (VRM) has been the standard in higher-power computers for some time thanks to their better cooling capability and less use of motherboard space compared to VR down. Physical size keeps diminishing to allow for more space savings and so the trend is to go for a small form factor such as 1U. The scaling down of CPU voltages demands more current from the VRM to meet ever-increasing power levels. This paper presents some low-cost methods for improving thermal capability while still allowing for excellent electrical design. The use of these combined improvements led to a 9% decrease in peak device temperature and 18% decrease in system average temperature which is enough to eliminate the need for a heat sink with 400 LFM airflow, 25degC ambient and no derating. The VRM is used as an example but the process is generalized so that it can be applied to may other systems.
Keywords
power supplies to apparatus; voltage regulators; higher-power computers; temperature 25 degC; thermal capability; voltage regulator module; Electronics cooling; Heat sinks; Power electronics; Power engineering computing; Regulators; Temperature; Thermal engineering; Thermal management; Virtual reality; Zero voltage switching;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics Specialists Conference, 2007. PESC 2007. IEEE
Conference_Location
Orlando, FL
ISSN
0275-9306
Print_ISBN
978-1-4244-0654-8
Electronic_ISBN
0275-9306
Type
conf
DOI
10.1109/PESC.2007.4341953
Filename
4341953
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