Title :
Process technique for singulating fragile devices
Author :
Agarwal, Ajay ; Mohanraj, S. ; Premachandran, C.S. ; Singh, Janak
Author_Institution :
Inst. of Microelectron., Singapore
Abstract :
This paper presents a novel process scheme for singulating microelectromechanical systems (MEMS) or CMOS devices that may be released or unreleased, which have fragile components and/or that have within or without in-plane structures. The process comprises spin coating of a polymer based protection material on the back and front of the device wafer, after attaching it to holder wafer. Such protected wafers are then singulated into individual chips using standard dicing saw. The process details, its advantages and results are elaborated
Keywords :
micromechanical devices; polymers; spin coating; CMOS devices; MEMS; device wafer; fragile components; fragile device singulation; holder wafer; microelectromechanical systems; polymer based protection material; spin coating; standard dicing saw; Coatings; Etching; Fabrication; Integrated circuit technology; Microelectromechanical devices; Microelectronics; Micromechanical devices; Optical devices; Optical materials; Protection;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614492
