Title :
Mechanism of underfill voids formation in flip chip packaging
Author :
Goh, E. ; Zhao, X.L. ; Anand, Ashok ; Mui, Y.C. ; Parthasarathy, Srinivasan ; Master, Raj N.
Author_Institution :
Adv. Micro Devices (Singapore) Pte Ltd., Singapore
Abstract :
Voids in flip chip packaging of organic land grid array (OLGA) caused by the inclusion of air, other gases and moisture were studied and experiments were designed to understand the cause of void formation. Reactions among the solder mask, flux residue, underfill and solder bump were investigated to understand the mechanism of voids formation during the assembly of the underfill flip chip packages. The results showed that the position and shape of the voids could provide the evidence of root cause. The paper also discusses procedures to eliminate the said voids
Keywords :
ball grid arrays; flip-chip devices; solders; voids (solid); OLGA; flip chip packaging; flux residue; organic land grid array; solder bump; solder mask; underfill flip chip packages; underfill voids formation; Assembly; Bonding; Curing; Flip chip; Integrated circuit packaging; Lead; Manufacturing; Moisture; Packaging machines; Plastic packaging;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614495
