Title :
Multichannel Mueller matrix analysis of the evolution of the microscopic roughness and texture during ZnO:Al chemical etching
Author :
Chen, Chi ; Ross, Christoph ; Podraza, N.J. ; Wronski, C.R. ; Collins, R.W.
Author_Institution :
Dept. of Phys. & Astron., Toledo Univ., OH, USA
Abstract :
Transparent conducting oxides (TCOs) are used in thin film silicon (Si:H) photovoltaics (PV) technology as top electrical contacts and as the components of back-reflecting structures. TCOs are often prepared with macroscopically rough interfaces and/or surfaces (i.e., with "texture") in order to scatter light and thereby enhance optical path lengths in the active layers of the device. Optical analysis of textured TCOs is a considerable challenge, due to the existence of surface roughness and non-uniformity over more than six orders of magnitude in the lateral scale L, from tenths of nanometers to hundreds of microns or more. In this research, we have developed the optical technique of multichannel Mueller matrix ellipsometry to extract the optical properties (ε1, ε2) of textured TCO films as well as the time evolution of surface roughness layer thicknesses on microscopic, macroscopic, and "geometrical optic" lateral scales during the TCO fabrication process.
Keywords :
II-VI semiconductors; aluminium; electrical contacts; ellipsometry; etching; geometrical optics; optical films; semiconductor thin films; surface roughness; surface texture; transparency; wide band gap semiconductors; zinc compounds; ZnO:Al; back-reflecting structures; chemical etching; electrical contacts; microscopic roughness; multichannel Mueller matrix analysis; multichannel Mueller matrix ellipsometry; optical path lengths; surface roughness; texture; thin film silicon photovoltaics technology; transparent conducting oxides; Chemical analysis; Etching; Geometrical optics; Microscopy; Optical devices; Optical films; Optical scattering; Rough surfaces; Surface roughness; Surface texture;
Conference_Titel :
Photovoltaic Specialists Conference, 2005. Conference Record of the Thirty-first IEEE
Print_ISBN :
0-7803-8707-4
DOI :
10.1109/PVSC.2005.1488433