Title :
Effects of re-finishing of terminations by solder-dipping on plastic quad flatpack electronic parts
Author :
Sengupta, Shirsho ; Das, Diganta ; Ganesan, Sanka ; Pecht, Michael ; Lin, T.Y. ; Rollins, William
Author_Institution :
Dept. of Mech. Eng., Maryland Univ., College Park, MD
Abstract :
Tin whiskering is a concern with high tin finishes on electronic part terminations. Solder-dipping is being used as a method for replacing the original finish with eutectic tin-lead solder, as a tin whisker risk mitigation method. The solder-dipping process however, may expose the electronic parts to additional risks due to the the finish quality and thermal shock produced by the dipping process. This paper presents the effects of solder-dipping as a refinishing technique on quality and reliability on three, 0.5 mm pitch, plastic quad flatpack (PQFP) parts. The paper discusses issues concerning quality of the new dipped finish and thermo-mechanical damage at critical package interfaces
Keywords :
eutectic alloys; fine-pitch technology; lead alloys; plastic packaging; soldering; tin alloys; 0.5 mm; Sn-Pb; electronic part terminations; eutectic tin-lead solder; plastic quad flatpack electronic parts; refinishing technique; solder-dipping process; thermal shock; thermo-mechanical damage; tin whisker risk mitigation method; tin whiskering; Educational institutions; Electric shock; Electronic packaging thermal management; Environmentally friendly manufacturing techniques; Finishing; History; Lead; Plastic packaging; Surface-mount technology; Tin;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614502
