Title :
Electromigration reliability of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy
Author :
Yi-Shao Lai ; Chen, Kuo-Mmg ; Lee, Chiu-Wen ; Chin-Li Kao ; Shao, Yu-Hsiu
Author_Institution :
Stress-Reliability Lab., Adv. Semicond. Eng., Inc., Kaohsiung
Abstract :
We examine electromigration fatigue reliability and morphological patterns of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite solder bumps in a flip-chip package assembly. The test vehicle is subjected to test conditions of five combinations of applied electric currents and ambient temperatures, namely, 0.4 A/150 degC, 0.5 A/150 degC, 0.6 A/125 degC, 0.6 A/135 degC, and 0.6 A/150 degC. An electrothermal coupling analysis is employed to investigate the current crowding effect and maximum temperature in the solder bump in order to correlate with the experimental reliability using the Black´s equation as a reliability model
Keywords :
assembling; composite material interfaces; copper; copper alloys; electromigration; flip-chip devices; lead alloys; metallurgy; nickel; reliability; silver alloys; solders; tin alloys; titanium; 0.4 A; 0.5 A; 0.6 A; 125 C; 135 C; 150 C; Black equation; Sn-Pb; SnAgCu; Ti-Ni-Cu; ambient temperatures; composite flip-chip solder bumps; current crowding effect; electric currents; electromigration fatigue reliability; electromigration reliability; electrothermal coupling analysis; flip-chip package assembly; morphological patterns; solder bump; under bump metallurgy; Assembly; Current; Electromigration; Electrothermal effects; Fatigue; Packaging; Proximity effect; Temperature; Testing; Vehicles;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614505
