Title :
EMI simulation and measurements of multilayer structures for microprocessor packaging applications
Author :
Rotaru, Mihai D. ; Rui, Yang ; Do, Nhon ; Mechaik, Mehdi
Author_Institution :
Inst. of Microelectron., Singapore
Abstract :
This paper presents an approach to understand the possible EMI sources in a complex microprocessor package. Simulation and measurements have been employed to characterize and understand the EMI emission from a test vehicle that resembles a microprocessor packages. The vehicle contained structures that are regularly find in processor packages. Detailed models of the test vehicle have been simulated using a commercial numerical simulation tool to understand and quantify the filed emission and the results have been compared with the measurements done in anechoic chamber. Good correlations were achieved between the measurements and simulations up to 5GHz. Advantages and limits of the simulation and measurements are presented and addressed
Keywords :
electromagnetic interference; electronics packaging; microprocessor chips; EMI emission; EMI simulation; anechoic chamber; microprocessor packaging; multilayer structures; numerical simulation tool; Anechoic chambers; Antenna measurements; Electromagnetic interference; Frequency; Microprocessors; Nonhomogeneous media; Numerical simulation; Packaging; Testing; Vehicles;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614513
