DocumentCode :
1562979
Title :
Micromachined silicon cantilevers and tips for bidirectional force microscopy
Author :
Buser, R.A. ; Brugger, J. ; Linder, C. ; de Rooij, N.F.
Author_Institution :
Inst. of Microtechnol., Neuchatel Univ., Switzerland
fYear :
1991
Firstpage :
249
Lastpage :
252
Abstract :
A monocrystalline silicon lever with an integrated silicon tip for a force/friction microscope was realized. Theoretical studies have been carried out to find the shape and dimensioning according to the mechanical system requirements. The layout dimension and the etching parameters have to be optimized as a function of the feedback obtained from the measurements with these structures in the AFM (atomic force microscope). Moreover, sharp tips with a high aspect ratio could be demonstrated. The method described can also be used to fabricate high aspect ratio cantilevers with an integrated tip, which is even easier than fabricating the tip on a square cross section.<>
Keywords :
atomic force microscopy; electric sensing devices; electrolytic machining; elemental semiconductors; etching; micromechanical devices; photolithography; silicon; sputter etching; vacuum microelectronics; AFM; RIE; Si; Si micromachining; bidirectional force microscopy; dimensioning; dry etching; element semiconductor; elemental semiconductor; etching parameters; force/friction microscope; high aspect ratio; integrated tip; layout dimension; micromachined cantilevers; micromachined tips; monocrystalline lever; optimized; photolithography; shape; sharp tips; vacuum microelectronics; wet etching; Atomic force microscopy; Force measurement; Friction; Mechanical systems; Resonance; Resonant frequency; Shape; Silicon; Surface topography; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors and Actuators, 1991. Digest of Technical Papers, TRANSDUCERS '91., 1991 International Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-87942-585-7
Type :
conf
DOI :
10.1109/SENSOR.1991.148849
Filename :
148849
Link To Document :
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