Title :
Case study of cost and performance trade-off analysis for mixed-signal integration in system-on-chip
Author :
Shen, Meigen ; Zheng, Li-Rong ; Tenhunen, Hannu
Abstract :
Owing to the rapid progress in submicron CMOS technology analog/RF circuitry, memory can be integrated into the same chip together with the digital circuitry. However, such an integration scenario also means extra costs for mixed signal isolation and technology fusion. In this paper, we analyze cost and performance trade-offs for mixed-signal integration in system-on-chip through case studies of wireless system integration. It is shown that, depending on system complexity, integration scale, and mixed-signal performance requirements, single chip integration is not necessarily better for some systems in term of implementation cost. The analysis method emphasizes a priori estimation, and hence is useful for addressing implementation issues at early conceptual-level design phases.
Keywords :
CMOS integrated circuits; SPICE; circuit simulation; integrated circuit economics; integrated circuit modelling; integrated circuit noise; mixed analogue-digital integrated circuits; system-on-chip; SPICE simulation; a priori estimation; analog/RF circuitry; cost performance trade-off analysis; early conceptual-level design phases; integration scale; mixed signal isolation; mixed-signal integration; mixed-signal performance requirements; noise coupling model; submicron CMOS technology; system-on-chip; technology fusion; wireless system integration; CMOS analog integrated circuits; CMOS digital integrated circuits; CMOS memory circuits; CMOS technology; Costs; Integrated circuit technology; Isolation technology; Performance analysis; Radio frequency; System-on-a-chip;
Conference_Titel :
Circuits and Systems, 2003. ISCAS '03. Proceedings of the 2003 International Symposium on
Print_ISBN :
0-7803-7761-3
DOI :
10.1109/ISCAS.2003.1206380
