• DocumentCode
    1563199
  • Title

    Advanced laminated antiferromagnetically coupled media with high thermal stability and low noise

  • Author

    Pang, S.I. ; Piramanayagam, S.N. ; Huang, Liwen ; Wang, J.P.

  • Author_Institution
    Data Storage Inst., Singapore, Singapore
  • fYear
    2002
  • Abstract
    Summary form only given. Currently, many studies have been carried out on laminated antiferromagnetically coupled (LAC) media to further increase the areal density of longitudinal recording. It is known that thermal stability of LAC media could be increased without increasing the M/sub r/t value. However, new structures/designs of media structures can improve the LAC media further. Our previous work has also shown that that Co layer inserted between Ru and magnetic layers could increase the exchange-coupling field (H/sub ex/). We report the advantages of a new structure for high density recording. We focus on the effects of the additional stabilizing layer (topmost layer) by varying its thickness. Recording performance of LAC media with a top stabilizing layer showed better SNR and lower noise. In conclusion, the incorporation of this very thin top stabilizing layer into LAC media could increase the thermal stability while reducing the noise of the media and is useful for pushing the areal density to a higher limit.
  • Keywords
    chromium alloys; cobalt alloys; exchange interactions (electron); laminates; magnetic multilayers; magnetic recording noise; ruthenium; thermal stability; CoCrPtB-Ru; LAC media; SNR; areal density; exchange-coupling field; high density recording; laminated antiferromagnetically coupled media; media structures; noise; thermal stability; Antiferromagnetic materials; Automatic frequency control; Couplings; Magnetic field measurement; Magnetic hysteresis; Magnetic materials; Magnetic noise; Magnetic susceptibility; Saturation magnetization; Thermal stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Magnetics Conference, 2002. INTERMAG Europe 2002. Digest of Technical Papers. 2002 IEEE International
  • Conference_Location
    Amsterdam, The Netherlands
  • Print_ISBN
    0-7803-7365-0
  • Type

    conf

  • DOI
    10.1109/INTMAG.2002.1000589
  • Filename
    1000589