Title :
A thermal model for a multichip device with changing cooling conditions
Author :
James, G.C. ; Pickert, Volker ; Cade, M.
Author_Institution :
Power Electron., Drives & Machines Group, Newcastle Univ., Newcastle upon Tyne
Abstract :
This paper describes the development of a thermal model for a multichip device cooled by a force cooled heatsink employing fan speed control. The model can be used to estimate the temperature of a device in a system where the thermal coupling between devices is significant and the characteristics of the heatsink are altered by the fan speed. The model is developed for a simplified experimental test configuration and is verified against practical results.
Keywords :
heat sinks; multichip modules; semiconductor device models; semiconductor device testing; changing cooling conditions; fan speed control; force cooled heatsink; multichip device; test configuration; thermal coupling; thermal model; Compact Model; Inverter; Multichip Module; Thermal Impedance Matrix; Thermal Model;
Conference_Titel :
Power Electronics, Machines and Drives, 2008. PEMD 2008. 4th IET Conference on
Conference_Location :
York
Print_ISBN :
978-0-86341-900-3
