DocumentCode :
156342
Title :
Formation of chips with passive part by the alumina technology for microwave attenuator
Author :
Litvinovich, G.V. ; Sokol, V.A.
Author_Institution :
Belarusian State Univ. of Inf. & Radioelectron., Minsk, Belarus
fYear :
2014
fDate :
7-13 Sept. 2014
Firstpage :
677
Lastpage :
678
Abstract :
The paper concerns the application of the electrochemical alumina technology for the formation of chips with passive part for microwave attenuators. The structure of this chip consists of an aluminum base with an anodic dielectric Al2O3 layer, copper strip lines and contact pads at the alumina surface, and a thin-film resistor. Experimental results verify availability of this technology for the microwave attenuator manufacturing.
Keywords :
aluminium compounds; attenuators; dielectric materials; microwave circuits; Al2O3; anodic dielectric layer; chip formation; contact pads; copper strip lines; electrochemical alumina technology; microwave attenuator; passive part; thin-film resistor;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave & Telecommunication Technology (CriMiCo), 2014 24th International Crimean Conference
Conference_Location :
Sevastopol
Print_ISBN :
978-966-335-412-5
Type :
conf
DOI :
10.1109/CRMICO.2014.6959580
Filename :
6959580
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=156342
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