Title :
Thermal Design Considerations for Integrated Power Electronics Modules based on Temperature Distribution Cases Study
Author :
Chen, Qiaoliang ; Yang, Xu ; Wang, Zhaoan ; Zhang, Lianghua ; Zheng, Ming
Author_Institution :
Xi´´an Jiaotong Univ., Xian
Abstract :
The thermal performance of IPEM (integrated power electronics modules) is very important with high reliability requirements. In this paper, some design considerations based on different temperature distribution cases study are performed on an example prototype, a 2 kW PFC active IPEM employing CoolMOS and SiC diode. The thermal model of IPEM is developed and the power dissipation of every power devices in the active IPEM is calculated through the measurement-based power loss graph in datasheet. With the requirements of uniform temperature distribution and slight thermal interaction between power dice, the variation of temperature gradient distribution with the heat transfer coefficient of heatsink and die position is analyzed. The thermal interaction distance of power die is investigated and the tradeoff between thermal and electrical design is considered. The analysis is verified by the simulation and power experimental results.
Keywords :
integrated circuit design; modules; power electronics; thermal management (packaging); die position; electrical design; heatsink heat transfer coefficient; integrated power electronics module; power device; reliability requirement; temperature distribution; thermal design; Analytical models; Diodes; Heat transfer; Loss measurement; Power dissipation; Power electronics; Power measurement; Prototypes; Silicon carbide; Temperature distribution; Integrated power electronics modules (IPEMs); Temperature; Thermal;
Conference_Titel :
Power Electronics Specialists Conference, 2007. PESC 2007. IEEE
Conference_Location :
Orlando, FL
Print_ISBN :
978-1-4244-0654-8
Electronic_ISBN :
0275-9306
DOI :
10.1109/PESC.2007.4342133
