Title :
Electric Characteristics of Planar Interconnect Technologies for Power MOSFETs
Author :
Dieckerhoff, Sibylle ; Kirfe, Tino ; Wernicke, Thies ; Kallmayer, Christine ; Ostmann, Andreas ; Jung, Erik ; Wunderle, Bernhard ; Reichl, Herbert
Author_Institution :
Tech. Univ. of Berlin, Berlin
Abstract :
In this paper, two planar interconnection technologies for power semiconductors - a Flip Chip solution with a flexible substrate and a Chip-in-Polymer approach - are presented. These technologies substitute the wire bonds which are usually applied to contact the top side pads of power semiconductors. The process flow of the technology developments is explained. Exemplarily, prototypes are built applying fast switching MOSFETs in the voltage class up to 100 V. Based on these prototypes, experimental and simulation results with regard to the thermo-electric characteristics of the prototypes are discussed.
Keywords :
chip-on-board packaging; interconnections; power MOSFET; semiconductor device packaging; thermoelectric devices; chip-in-polymer technology; flexible substrate; flip-chip devices; planar interconnect technologies; power MOSFET; power semiconductors; thermo-electric characteristics; Assembly; Electric variables; Electronics cooling; Integrated circuit interconnections; MOSFETs; Packaging; Prototypes; Substrates; Voltage; Wire;
Conference_Titel :
Power Electronics Specialists Conference, 2007. PESC 2007. IEEE
Conference_Location :
Orlando, FL
Print_ISBN :
978-1-4244-0654-8
Electronic_ISBN :
0275-9306
DOI :
10.1109/PESC.2007.4342134
