DocumentCode
1563973
Title
A Fully Integrated 300°C, 4 kW, 3-Phase, SiC Motor Drive Module
Author
Hornberger, J.M. ; Cilio, E. ; McPherson, Brice ; Schupbach, R.M. ; Lostetter, Alexander B.
Author_Institution
Arkansas Power Electron. Int., Inc, Fayetteville
fYear
2007
Firstpage
1048
Lastpage
1053
Abstract
The researchers have designed, developed, packaged, and manufactured a complete multichip power module (MCPM) that integrates silicon carbide (SiC) power transistors with silicon on insulator (SOI) control electronics. The SiC MCPM approach targets the reduction of size and the increase in efficiency of power electronic systems resulting in a highly miniaturized, high power density module. The researchers previously presented a single phase 3 kW SiC inverter that was also proven operational to 250degC at 500 W. In this paper APEI, Inc. will present a new SiC three-phase inverter that has been fully tested to 4 kW at 300degC operation. In this paper, the researchers discuss the challenges associated with high-temperature operation of power electronics, including the electrical, mechanical, and thermal design. Many electronic packaging problems have been solved to enable high-temperature operation of these modules. These packaging issues will be discussed as well as remaining problems that still need advancing. Finally, the full temperature and full power (300degC at 4 kW) test results are presented.
Keywords
invertors; motor drives; power electronics; power transistors; silicon-on-insulator; MCPM; SOI control electronics; SiC motor drive module; multichip power module; power 3 kW; power 4 kW; power 500 W; power electronic system; silicon carbide power transistors; silicon-on-insulator; temperature 250 degC; temperature 300 degC; three-phase inverter; Electronic packaging thermal management; Electronics packaging; Inverters; Manufacturing; Motor drives; Multichip modules; Power electronics; Silicon carbide; Silicon on insulator technology; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics Specialists Conference, 2007. PESC 2007. IEEE
Conference_Location
Orlando, FL
ISSN
0275-9306
Print_ISBN
978-1-4244-0654-8
Electronic_ISBN
0275-9306
Type
conf
DOI
10.1109/PESC.2007.4342136
Filename
4342136
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