• DocumentCode
    1563973
  • Title

    A Fully Integrated 300°C, 4 kW, 3-Phase, SiC Motor Drive Module

  • Author

    Hornberger, J.M. ; Cilio, E. ; McPherson, Brice ; Schupbach, R.M. ; Lostetter, Alexander B.

  • Author_Institution
    Arkansas Power Electron. Int., Inc, Fayetteville
  • fYear
    2007
  • Firstpage
    1048
  • Lastpage
    1053
  • Abstract
    The researchers have designed, developed, packaged, and manufactured a complete multichip power module (MCPM) that integrates silicon carbide (SiC) power transistors with silicon on insulator (SOI) control electronics. The SiC MCPM approach targets the reduction of size and the increase in efficiency of power electronic systems resulting in a highly miniaturized, high power density module. The researchers previously presented a single phase 3 kW SiC inverter that was also proven operational to 250degC at 500 W. In this paper APEI, Inc. will present a new SiC three-phase inverter that has been fully tested to 4 kW at 300degC operation. In this paper, the researchers discuss the challenges associated with high-temperature operation of power electronics, including the electrical, mechanical, and thermal design. Many electronic packaging problems have been solved to enable high-temperature operation of these modules. These packaging issues will be discussed as well as remaining problems that still need advancing. Finally, the full temperature and full power (300degC at 4 kW) test results are presented.
  • Keywords
    invertors; motor drives; power electronics; power transistors; silicon-on-insulator; MCPM; SOI control electronics; SiC motor drive module; multichip power module; power 3 kW; power 4 kW; power 500 W; power electronic system; silicon carbide power transistors; silicon-on-insulator; temperature 250 degC; temperature 300 degC; three-phase inverter; Electronic packaging thermal management; Electronics packaging; Inverters; Manufacturing; Motor drives; Multichip modules; Power electronics; Silicon carbide; Silicon on insulator technology; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics Specialists Conference, 2007. PESC 2007. IEEE
  • Conference_Location
    Orlando, FL
  • ISSN
    0275-9306
  • Print_ISBN
    978-1-4244-0654-8
  • Electronic_ISBN
    0275-9306
  • Type

    conf

  • DOI
    10.1109/PESC.2007.4342136
  • Filename
    4342136