• DocumentCode
    1564345
  • Title

    A system to translate product yield targets to equipment particle targets

  • Author

    Inani, Anand ; Fang, Hua ; Stine, Brian

  • Author_Institution
    PDF Solutions, Inc., San Jose, CA
  • fYear
    2008
  • Firstpage
    72
  • Lastpage
    75
  • Abstract
    Random defectivity reduction is an important prerequisite to achieving mature production yields. The typical technology roadmap includes a product yield / defect density reduction curve over the technology lifetime. Translating the defect density reduction curve into specific monthly targets for each individual module or for each single tool, has proven to be an extremely challenging task. This paper summarizes a proposed method to translate overall technology or product yield targets into corresponding defect density targets allocated to each tool. Achieving this task requires extensive characterization and modeling. This method was eventually used at a fab running 130 nm 6 metal layer copper process.
  • Keywords
    inspection; production equipment; semiconductor device manufacture; defect density reduction; defect density targets allocation; equipment particle targets; metal layer copper process; random defectivity reduction; technology lifetime; translate product yield targets; Copper; Feature extraction; Inspection; Investments; Manufacturing processes; Neodymium; Particle production; Poles and towers; Production systems; Semiconductor device manufacture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference, 2008. ASMC 2008. IEEE/SEMI
  • Conference_Location
    Cambridge, MA
  • ISSN
    1078-8743
  • Print_ISBN
    978-1-4244-1964-7
  • Electronic_ISBN
    1078-8743
  • Type

    conf

  • DOI
    10.1109/ASMC.2008.4529012
  • Filename
    4529012