• DocumentCode
    1564372
  • Title

    Thickness and Uniformity Modeling of the Deposition of Shape Memory Polymers for Information Storage Applications

  • Author

    Wornyo, Edem ; Gall, Ken ; May, Gary S.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA
  • fYear
    2008
  • Firstpage
    85
  • Lastpage
    89
  • Abstract
    Shape memory polymers are of interest as high-capacity information storage media. This research seeks to understand the effects of processing conditions on the following candidate polymers: diethylene glycol dimethacrylate (DEGDMA), tertbutyl acrylate (tBA), and bisphenol. Full factorial experiments were performed using three input factors: spin speed, spin time, and nitrogen flow rate. A total of ten experiments were conducted. The measured responses were film thickness, uniformity, hardness and modulus of the materials. Analysis of variance revealed that all input parameters were significant with respect to the film thickness. The full factorial experiments were augmented to a central composite face (CCF) design to enable response surface modeling. Neural network models were developed to examine relationships between the spin speed and thickness of spin coated films. The average predictability of the model was better than 2% for training and less than 15% in testing. This research is expected to aid in understanding the use of these materials in information storage.
  • Keywords
    neural nets; shape memory effects; spin coating; central composite face design; diethylene glycol dimethacrylate; high-capacity information storage media; information storage; information storage applications; neural network models; shape memory polymers; spin coated films; tertbutyl acrylate; thickness-uniformity modeling; Analysis of variance; Conducting materials; Material storage; Neural networks; Nitrogen; Polymers; Predictive models; Response surface methodology; Shape; Thickness measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference, 2008. ASMC 2008. IEEE/SEMI
  • Conference_Location
    Cambridge, MA
  • ISSN
    1078-8743
  • Print_ISBN
    978-1-4244-1964-7
  • Electronic_ISBN
    1078-8743
  • Type

    conf

  • DOI
    10.1109/ASMC.2008.4529015
  • Filename
    4529015