A Methodology for Improving Granularity of Wafer Strength Testing to Characterize and Qualify a 150 micron DFM Wafer Thinning Process

Wafer thinning has been one of the key enabling processes for ultra compact portable consumer devices to make ultra thin device packages possible. These new devices require finish wafer thicknesses of 150¿m and under to match decreasing package sizes. There are a variety of wafer thinning techniques that can be utilized to create the desired wafer thicknesses. This paper will present a methodology that can be used to characterize and qualify a 150¿m wafer thinning process designed for a high volume analog manufacturing facility.