DocumentCode
1564494
Title
Single Wafer Management for Non Productive Wafers NPW
Author
Zaugg, Franz
Author_Institution
VP Sales & Marketing. Tec-Sem AG, Taegerwilen
fYear
2008
Firstpage
191
Lastpage
195
Abstract
Our industry understands quite well that there is more agility and efficiency in the front end wafer fab automation required. Initiatives as the 300 mm prime discussion and about small lot manufacturing (SLM) stand for the challenges of the semiconductor industry for concepts which offer improved productivity. Analysis from major IC manufacturers of state-of- the-art fabs has shown that: 70% of the time a wafer is just waiting - Up to 70% of the wafer cycle time is waiting time. - Only 10% is process time. -NPW ratio vs WIP is higher than 50% - Average filling grade for NPW´s in FOUPS can be only 40% - NPW consumption is often not under control. Above facts are resulting in extremely long cycle times, low process tool utilization and huge waste.
Keywords
integrated circuit manufacture; IC manufacturers; front end wafer fab automation; process tool utilization; semiconductor industry; single wafer management; small lot manufacturing; Electronics industry; Logistics; Manufacturing automation; Manufacturing industries; Marketing and sales; Marketing management; Productivity; Semiconductor device manufacture; Technology management; Transportation; 300mm wafer prime; Bare Wafer Stocker; Non Productive Wafer (NPW) Management; Single Wafer Management; Small Lot Manufacturing, (SLM);
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference, 2008. ASMC 2008. IEEE/SEMI
Conference_Location
Cambridge, MA
ISSN
1078-8743
Print_ISBN
978-1-4244-1964-7
Electronic_ISBN
1078-8743
Type
conf
DOI
10.1109/ASMC.2008.4529027
Filename
4529027
Link To Document