• DocumentCode
    1564494
  • Title

    Single Wafer Management for Non Productive Wafers NPW

  • Author

    Zaugg, Franz

  • Author_Institution
    VP Sales & Marketing. Tec-Sem AG, Taegerwilen
  • fYear
    2008
  • Firstpage
    191
  • Lastpage
    195
  • Abstract
    Our industry understands quite well that there is more agility and efficiency in the front end wafer fab automation required. Initiatives as the 300 mm prime discussion and about small lot manufacturing (SLM) stand for the challenges of the semiconductor industry for concepts which offer improved productivity. Analysis from major IC manufacturers of state-of- the-art fabs has shown that: 70% of the time a wafer is just waiting - Up to 70% of the wafer cycle time is waiting time. - Only 10% is process time. -NPW ratio vs WIP is higher than 50% - Average filling grade for NPW´s in FOUPS can be only 40% - NPW consumption is often not under control. Above facts are resulting in extremely long cycle times, low process tool utilization and huge waste.
  • Keywords
    integrated circuit manufacture; IC manufacturers; front end wafer fab automation; process tool utilization; semiconductor industry; single wafer management; small lot manufacturing; Electronics industry; Logistics; Manufacturing automation; Manufacturing industries; Marketing and sales; Marketing management; Productivity; Semiconductor device manufacture; Technology management; Transportation; 300mm wafer prime; Bare Wafer Stocker; Non Productive Wafer (NPW) Management; Single Wafer Management; Small Lot Manufacturing, (SLM);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference, 2008. ASMC 2008. IEEE/SEMI
  • Conference_Location
    Cambridge, MA
  • ISSN
    1078-8743
  • Print_ISBN
    978-1-4244-1964-7
  • Electronic_ISBN
    1078-8743
  • Type

    conf

  • DOI
    10.1109/ASMC.2008.4529027
  • Filename
    4529027