An efficient methodology for Electrical Monitoring in manufacturing environment

In semiconductor companies, two steps of electrical measurement are used to monitor wafer processing : 1. process control monitoring (PCM) test done at wafer level in scribe line device, reliability, defects tests are done to insure wafer quality & centrage. 2. wafer probe test (WPT) done at the end of process flow on product chips to evaluate product fonctionnality and to identify failing chips. PCM parameters are usually very numerous and cover distinct areas such as device features, metallization characteristics and electrical defectivity monitors. This abstract describes a production proven method that enables such as a detectability on PCM parameters regardless of their quantity and centering.