Title :
Analysis of laminated cores through a directly coupled 2D-1D electromagnetic field formulation
Author :
Bottauscio, O. ; Chiampi, M.
Author_Institution :
Ist. Elettrotecnico Nazionale Galileo Ferraris, Torino, Italy
Abstract :
Summary form only given. One of the most critical aspect in the modelling of laminated cores is the capability to evaluate the influence of the skin effect in the lamination depth on the magnetic flux distribution in the sheet plane. On this subject, the authors have already presented a computational procedure, based on a standard vector potential 2D magnetic field solution, which accounts for the effects of eddy currents flowing along the rolling plane both for unidirectional and for rotational fluxes. The proposed procedure handles the diffusion phenomena in the lamination depth by means of a dynamic magnetic model, consisting of the solution of 1D electromagnetic field problems defined in the sheet thickness. The linkage between the 2D (xy-plane) and 1D (z-axis) electromagnetic problems requires the use of two nested iterative Fixed Point (FP) schemes. Here an alternative approach is proposed, by directly coupling the equations governing the 2D and 1D electromagnetic field problems, to reduce the computational burden of the entire algorithm, without affecting the result accuracy.
Keywords :
Helmholtz equations; eddy currents; electromagnetic field theory; laminations; magnetic cores; skin effect; Helmholtz equations; diffusion phenomena; directly coupled 2D-1D electromagnetic field formulation; dynamic magnetic model; eddy currents; fixed point schemes; laminated cores; lamination depth; magnetic flux distribution; modelling; sheet plane; sheet thickness; skin effect; standard vector potential 2D magnetic field solution; Eddy currents; Electromagnetic analysis; Electromagnetic coupling; Electromagnetic fields; Electromagnetic modeling; Lamination; Magnetic analysis; Magnetic cores; Magnetic flux; Skin effect;
Conference_Titel :
Magnetics Conference, 2002. INTERMAG Europe 2002. Digest of Technical Papers. 2002 IEEE International
Conference_Location :
Amsterdam, The Netherlands
Print_ISBN :
0-7803-7365-0
DOI :
10.1109/INTMAG.2002.1000739