Title :
On-Chip Bondwire Inductor with Ferrite-Epoxy Coating: A Cost-Effective Approach to Realize Power Systems on Chip
Author :
Shen, Z. John ; Lu, Jian ; Cheng, Xu ; Jia, Ho Ngwei ; Xun Go ng
Author_Institution :
Univ. of Central Florida, Orlando
Abstract :
A novel concept of on-chip bondwire inductors with ferrite epoxy coating is proposed to provide a cost effective approach realizing power systems on chip (SOC). A Q factor of 30-40 is experimentally demonstrated which represents an improvement by a factor of 3-30 over the state-of-the-art MEMS micromachined inductors. More importantly, the bondwire inductors can be easily integrated into power SOC manufacturing processes with minimal changes, and open enormous possibilities for realizing cost-effective, high current, high efficiency power SOC´s.
Keywords :
Q-factor; inductors; integrated circuit manufacture; micromachining; power integrated circuits; system-on-chip; MEMS micromachined inductors; Q factor; bondwire inductors; ferrite-epoxy coating; on-chip bondwire inductor; power SOC manufacturing; power systems on chip; Bonding; Coatings; Costs; Ferrites; Inductors; Manufacturing processes; Micromechanical devices; Power systems; Q factor; System-on-a-chip; On-chip inductor; SOC; ferrite; wirebond;
Conference_Titel :
Power Electronics Specialists Conference, 2007. PESC 2007. IEEE
Conference_Location :
Orlando, FL
Print_ISBN :
978-1-4244-0654-8
Electronic_ISBN :
0275-9306
DOI :
10.1109/PESC.2007.4342235
