Title :
Using Partial Die in Radial Zone Analysis
Author :
Kermel, Lori Maiorino ; McLean, Malcolm
Author_Institution :
IBM Corp., East Fishkill, NY
Abstract :
In this paper, we identify the methodology for characterization of edge die defects by introducing inspection of partial die, zonal analysis and describing the process flow to determine the root cause of unique edge defects.
Keywords :
integrated circuits; edge die defects; partial die inspection; process flow; radial zone analysis; zonal analysis; Data analysis; Inspection; Pareto analysis; Pattern analysis; Performance analysis; Process control; Semiconductor device manufacture; Software tools; Testing; Edge die inspection; electrical data; uniformity; wafer edge defects; yield loss;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference, 2008. ASMC 2008. IEEE/SEMI
Conference_Location :
Cambridge, MA
Print_ISBN :
978-1-4244-1964-7
Electronic_ISBN :
1078-8743
DOI :
10.1109/ASMC.2008.4529074
