Title :
SPAN: Tightly coupled thermal and electrical simulation
Author :
Klaassen, B. ; Paap, K.L.
Author_Institution :
GMD-SET, St. Augustin, Germany
Abstract :
A method is presented to combine solvers for ordinary and partial differential equations, like SPICE and ANSYS, for thermal-electrical analysis of integrated circuits or systems. A sketch of a first prototype program (SPAN) is given together with the theoretical background, which makes use of convergence principles from waveform relaxation. The approach can also be extended to more general problems within mechatronics simulation
Keywords :
circuit CAD; digital simulation; integrated circuit design; integrated circuit modelling; iterative methods; mechatronics; partial differential equations; ANSYS; SPAN; SPICE; accelerometers; convergence principles; electrical simulation; integrated circuits; mechatronics; mechatronics simulation; partial differential equations; prototype program; thermal simulation; thermal-electrical analysis; waveform relaxation; Circuit analysis; Circuit simulation; Coupling circuits; Mechatronics; Partial differential equations; Prototypes; SPICE; Silicon; Temperature sensors; Thermal conductivity;
Conference_Titel :
Design Automation Conference, 1993, with EURO-VHDL '93. Proceedings EURO-DAC '93., European
Conference_Location :
Hamburg
Print_ISBN :
0-8186-4350-1
DOI :
10.1109/EURDAC.1993.410653
