• DocumentCode
    156681
  • Title

    Thermal challenges to building reliable embedded systems

  • Author

    Zebo Peng

  • Author_Institution
    Embedded Syst. Lab., Linkoping Univ., Linkoping, Sweden
  • fYear
    2014
  • fDate
    28-30 April 2014
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    More and more embedded systems are used in safety-critical areas such as automotive electronics and medical applications. These safety-critical applications impose stringent requirements on reliability, performance, low-power and testability of the underlying VLSI circuits. With silicon technology scaling, however, VLSI circuits operate very often at high temperature, which has negative impact on reliability, performance, power-efficiency and testability. This paper discusses several thermal impacts on VLSI circuits and their related challenges. It presents also a few emerging techniques that take temperature into account in the design and test processes.
  • Keywords
    VLSI; elemental semiconductors; embedded systems; integrated circuit design; integrated circuit reliability; integrated circuit testing; low-power electronics; silicon; thermal management (packaging); Si; VLSI circuit; automotive electronics; embedded system; low-power electronics; medical applications; reliability; safety-critical application; silicon technology scaling; testability; thermal challenge; Clocks; Embedded systems; Integrated circuit reliability; Power demand; Temperature sensors; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, Automation and Test (VLSI-DAT), 2014 International Symposium on
  • Conference_Location
    Hsinchu
  • Type

    conf

  • DOI
    10.1109/VLSI-DAT.2014.6834936
  • Filename
    6834936