• DocumentCode
    1568478
  • Title

    Design time body bias selection for parametric yield improvement

  • Author

    Zhuo, Cheng ; Chang, Yung-Hsu ; Sylvester, Dennis ; Blaauw, David

  • Author_Institution
    EECS Dept., Univ. of Michigan, Ann Arbor, MI, USA
  • fYear
    2010
  • Firstpage
    681
  • Lastpage
    688
  • Abstract
    Circuits designed in aggressively scaled technologies face both stringent power constraints and increased process variability. Achieving high parametric yield is a key design objective, but is complicated by the correlation between power and performance. This paper proposes a novel design time body bias selection framework for parametric yield optimization while reducing testing costs. The framework considers both inter- and intra-die variations as well as power-performance correlations. This approach uses a feature extraction technique to explore the underlying similarity between the gates for effective clustering. Once the gates are clustered, a Gaussian quadrature based model is applied for fast yield analysis and optimization. This work also introduces an incremental method for statistical power computation to further reduce the optimization complexity. The proposed framework improves parametric yield from 39% to 80% on average for 11 benchmark circuits while runtime is linear with circuit size and on the order of minutes for designs with up to 15 K gates.
  • Keywords
    feature extraction; integrated circuit design; integrated circuit manufacture; Gaussian quadrature; benchmark circuits; design time body bias selection; fast yield analysis; feature extraction technique; parametric yield improvement; power constraints; power-performance correlations; Chip scale packaging; Circuit optimization; Circuit testing; Cost function; Delay; Design optimization; Integrated circuit yield; Manufacturing; Optimization methods; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (ASP-DAC), 2010 15th Asia and South Pacific
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-5765-6
  • Electronic_ISBN
    978-1-4244-5767-0
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2010.5419802
  • Filename
    5419802