DocumentCode
1568803
Title
An industrial perspective of 3D IC integration technology from the viewpoint of design technology
Author
Choi, Kyu-Myung
Author_Institution
Samsung Electron. Co., Ltd., Suwon, South Korea
fYear
2010
Firstpage
544
Lastpage
547
Abstract
3D IC integration is very important to overcome the technology scaling barriers and to satisfy mobile devices´ demand. In this paper, we describe the challenges we are facing in developing 3D IC design methodology, especially in the case of TSV-SiP (Logic-Memory die stacking). Also, appropriate development approaches are proposed. The EDA tools for TSV-SiP, which are initially provided by extending current conventional tools, will be gradually enhanced to better support 3D IC designs.
Keywords
integrated circuit design; integrated logic circuits; three-dimensional integrated circuits; 3D IC integration technology; EDA tools; TSV-SiP; design technology; industrial perspective; logic-memory die stacking; mobile device demand; through-silicon-via; Design methodology; Integrated circuit modeling; Logic devices; Random access memory; Semiconductor device packaging; Signal analysis; Signal design; Stacking; Three-dimensional integrated circuits; Through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference (ASP-DAC), 2010 15th Asia and South Pacific
Conference_Location
Taipei
Print_ISBN
978-1-4244-5765-6
Electronic_ISBN
978-1-4244-5767-0
Type
conf
DOI
10.1109/ASPDAC.2010.5419823
Filename
5419823
Link To Document