Title :
An industrial perspective of 3D IC integration technology from the viewpoint of design technology
Author_Institution :
Samsung Electron. Co., Ltd., Suwon, South Korea
Abstract :
3D IC integration is very important to overcome the technology scaling barriers and to satisfy mobile devices´ demand. In this paper, we describe the challenges we are facing in developing 3D IC design methodology, especially in the case of TSV-SiP (Logic-Memory die stacking). Also, appropriate development approaches are proposed. The EDA tools for TSV-SiP, which are initially provided by extending current conventional tools, will be gradually enhanced to better support 3D IC designs.
Keywords :
integrated circuit design; integrated logic circuits; three-dimensional integrated circuits; 3D IC integration technology; EDA tools; TSV-SiP; design technology; industrial perspective; logic-memory die stacking; mobile device demand; through-silicon-via; Design methodology; Integrated circuit modeling; Logic devices; Random access memory; Semiconductor device packaging; Signal analysis; Signal design; Stacking; Three-dimensional integrated circuits; Through-silicon vias;
Conference_Titel :
Design Automation Conference (ASP-DAC), 2010 15th Asia and South Pacific
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-5765-6
Electronic_ISBN :
978-1-4244-5767-0
DOI :
10.1109/ASPDAC.2010.5419823
