• DocumentCode
    1569047
  • Title

    Intel LVS logic in CNT technology

  • Author

    Zeng, Xuan ; Liu, Bao ; Cao, Zhen ; Tao, Jun ; Wong, Philip H S ; Tang, Pushan

  • Author_Institution
    Fudan Univ., Shanghai, China
  • fYear
    2010
  • Firstpage
    13
  • Lastpage
    16
  • Abstract
    In this paper, we systematically evaluate combinational logic families for CNT technology implementation for a variety of logic families, signal transition times, and transistor parameters. We compare CMOS static logic, and Intel LVS logic in CNT and silicon technologies by SPICE simulation based on Predictive Technology Model and Stanford compact CNFET models. We observe that CMOS static logic in CNT technology achieves limited (e.g., 3.44×) performance improvement and (e.g., 3.83×) power consumption reduction, while Intel LVS logic achieves more significant performance improvement and orders-of-magnitude of power consumption reduction. Intel LVS logic achieves an average of 4.02× performance improvement and 1137.64× power consumption reduction compared with CMOS static logic in silicon for the same combinational logic functions and input signals, and enhanced reliability, making it an ideal combinational logic circuit paradigm in CNT technology.
  • Keywords
    CMOS integrated circuits; circuit reliability; combinational circuits; logic design; CMOS static logic; CNT technology; Intel LVS logic; SPICE simulation; Stanford compact CNFET models; combinational logic circuit; combinational logic families; input signals; power consumption reduction; predictive technology model; reliability; signal transition times; silicon technologies; transistor parameters; CMOS logic circuits; CMOS technology; Combinational circuits; Energy consumption; Logic functions; Power system modeling; Predictive models; SPICE; Semiconductor device modeling; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (MWSCAS), 2010 53rd IEEE International Midwest Symposium on
  • Conference_Location
    Seattle, WA
  • ISSN
    1548-3746
  • Print_ISBN
    978-1-4244-7771-5
  • Type

    conf

  • DOI
    10.1109/MWSCAS.2010.5548549
  • Filename
    5548549