Title :
What kinds of SOI wafers are suitable for what micromachining purposes?
Author_Institution :
Hamamatsu Univ., Sch. of Med., Japan
Abstract :
SIMOX (separation by implanted oxygen), ZMR (zone melting recrystallization), and bonded SOI wafers are compared from the viewpoint of applications to sensors and actuators (S&A). These are whole wafers scale SOIs. Other local SOI technologies are discussed. It is noted that SOI wafers are especially attractive for smart power S&A, as each component is dielectrically isolated. Mobile elements such as diaphragm, cantilever, bridge, rotor, and valve can be fabricated by single-crystal silicon.<>
Keywords :
diaphragms; electric actuators; electric sensing devices; elemental semiconductors; integrated circuit technology; ion implantation; micromechanical devices; recrystallisation; semiconductor technology; semiconductor-insulator boundaries; silicon; SIMOX; SOI wafers; Si-SiO/sub 2/; actuators; bonded wafers; bridge; cantilever; diaphragm; dielectrically isolated; elemental semiconductors; micromachining; mobile elements; rotor; sensors; single crystal Si; smart power; valve; whole wafers scale; zone melting recrystallization; Annealing; CMOS technology; Etching; Intelligent sensors; Isolation technology; Micromachining; Silicon on insulator technology; Temperature sensors; Thermal expansion; Thermal stresses;
Conference_Titel :
Solid-State Sensors and Actuators, 1991. Digest of Technical Papers, TRANSDUCERS '91., 1991 International Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-87942-585-7
DOI :
10.1109/SENSOR.1991.148909
